BGA Solder Ball
Product Features ：
Superior oxidation resistance
Precise composition
High brightness, no pollutants or dents
High solid sphere and precise diameter
Custom special material and ball diameter
Product Use ：
IC Assembly
BGA/FC/WLCSP/SMT/REWORK Etc.
Product Specification ：
Diameter | Tolerance | Spheroid Tolerance | CPK/CPK |
| 0.889 | 0.015 | Within 1.5% | ≥1.33 |
| 0.76 | |||
| 0.65 | |||
| 0.20~0.60 | 0.01 | ||
| 0.15 | 0.005 | ||
| 0.10 | |||
| 0.075 | 0.003 | ||
| 0.05 |
